Calculation of Thermal Solid Coupling Fatigue Life of Module Power Supply under Thermal Load

MA Yuwei; QIAN Yaxin; ZHANG Jing; LYU Yongguo; WANG Ganghu

doi:10.7643/ issn.1672-9242.2025.12.014

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Equipment Environmental Engineering ›› 2025, Vol. 22 ›› Issue (12) : 111-117. DOI: 10.7643/ issn.1672-9242.2025.12.014

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Calculation of Thermal Solid Coupling Fatigue Life of Module Power Supply under Thermal Load

MA Yuwei, QIAN Yaxin, ZHANG Jing, LYU Yongguo, WANG Ganghu

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Abstract

The work aims to calculate the damage degree and fatigue life of a shipboard DC-DC module power supply structure under the condition of high and low temperature cycles. A finite element analysis model based on thermal solid coupling was established to analyze the structural strength of the module power supply operating at room temperature without or with heat radiators. The effect of temperature on the structure was investigated, and the finite element model was verified by experiments to ensure its effectiveness and accuracy. The Manson-Coffin fatigue life numerical simulation model was established, and the low cycle fatigue life prediction and fatigue damage analysis based on the strain-life method were carried out considering the STW average stress correction criterion. The effect of temperature field on the structure field was significant. After installation of the radiator, the deformation of the module power structure and the maximum value of equivalent stress were significantly reduced, the displacement response was reduced by 71.8%, and the equivalent stress response was reduced by 64.2%. The fatigue life analysis of the module power supply with the heat radiator was carried out based on thermal coupling. By simulating the structural state of the module power supply under high and low temperature cycles, the fatigue life of the module power supply were obtained. This study provides a method for fatigue life analysis of the module power supply under simulated high and low temperature cycles, and comprehensively evaluates the structure of the module power supply, which provides reference and basis for structural design and replacement of the module power supply.

Key words

module power supply / thermal solid coupling / fatigue life / temperature cycle / numerical simulation / Manson-Coffin model

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MA Yuwei, QIAN Yaxin, ZHANG Jing, LYU Yongguo, WANG Ganghu. Calculation of Thermal Solid Coupling Fatigue Life of Module Power Supply under Thermal Load[J]. Equipment Environmental Engineering. 2025, 22(12): 111-117 https://doi.org/10.7643/ issn.1672-9242.2025.12.014

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